Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating

ABSTRACT

A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

CROSS REFERENCE TO RERATED APPLICATION

This application is a divisional application of U.S. application Ser.No. 16/122,404 filed Sep. 5, 2018, which in turn is a continuationapplication of International Application No. PCT/JP2017/005177 filedFeb. 13, 2017 and claiming convention priority of Japanese PatentApplication No. 2016-048586 filed Mar. 11, 2016.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a method for producing a plated part(plated component) on which a plating film is selectively formed, theplated part (plated component), and a catalytic activity inhibitor.

Description of the Related Art

In recent years, a three-dimensional circuit formed part, in which anelectric circuit is formed on a surface of an injection-molded productor the like, is referred to as MID (Molded Interconnect Device), and itsapplication range is rapidly expanded. In the case of MID, it ispossible to form the circuit on the surface of the molded product havinga small size and a complicated shape. Therefore, MID is in consistencywith the trend of compactization (miniaturization) of electronic parts.For example, a small-sized part, in which an antenna or the like isformed on a surface of a casing of a smartphone, is mass-produced inChina. Further, the application of MID to sensors and lighting parts isalso actively investigated in the field of automobile principally inEurope. Further, at present, a large amount of cable harness (wireharness) is used for the automobile. If the cable harness is replacedwith MID, it is thereby possible to expect the decrease in the cost byrealizing a light weight and reducing the number of assembling steps.

A method explained below is suggested, for example, as a method forforming a wiring pattern (electric circuit) on a surface of aninsulating base member such as a resin molded product or the like. Atfirst, a metal layer is formed on the entire surface of the base member.Subsequently, the formed metal layer is subjected to the patterning witha photoresist, and then the metal layer of a portion other than thewiring pattern is removed by means of the etching. Accordingly, thewiring pattern can be formed by the metal layer allowed to remain on thesurface of the base member.

Further, a method, in which a laser beam is used, is suggested as amethod for forming a wiring pattern (electric circuit) without using anyphotoresist (for example, Patent Document 1: Japanese Patent No.3222660). At first, a laser beam is radiated onto a portion at which itis intended to form the wiring pattern, and thus the base member isroughened. Then, when an electroless plating catalyst is applied to thewhole of the base member, the electroless plating catalyst stronglyadheres to the portion irradiated with the laser beam as compared withthe other portions. Subsequently, when the base member is washed, thenthe electroless plating catalyst remains at only the portion irradiatedwith the laser beam, and the catalyst having been present at the otherportions can be removed with ease. The electroless plating is applied tothe base member on which the electroless plating catalyst adheres toonly the portion irradiated with the laser beam, and thus a plating filmcan be formed on only the portion irradiated with the laser beam, i.e.,on only the predetermined wiring pattern. In the case of the method forforming the wiring pattern based on the use of the laser beam, it ispossible to omit the labor and the cost for producing a photomask or thelike, and hence it is easy to change the wiring pattern.

An LDS (Laser Direct Structuring) method is practically applied asanother method for forming a wiring pattern (electric circuit) (forexample, Non-Patent Document 1: Wolfgang John, “Three-dimensionalcomponents for reducing production cost”, Industrial Laser SolutionsJapan, e. x. press, September 2011, p. 18-22; and Patent Document 2:European Patent No. 1274288). In the case of the LDS method, a coppercomplex is kneaded into a thermoplastic resin to perform the injectionmolding, and the laser drawing is performed on a surface of a moldedproduct containing the copper complex. The copper complex is convertedinto the metal by being irradiated with the laser beam, the catalyticactivity of the electroless copper plating is expressed, and it ispossible to plate the portion subjected to the laser drawing. The LDSmethod makes it possible to produce a three-dimensional circuit formedpart (MID) in which a circuit is formed on a surface of aninjection-molded product having a complicated shape. The LDS methodcomes into widespread use in the production of smartphones andautomobiles.

A method, which is different from the method for kneading the catalystinto the molded product like the LDS method, is also suggested (forexample, Patent Document 3: Japanese Patent Application Laid-open No.2012-136769). Patent Document 3 discloses a method in which a functionalgroup is applied to a surface of a molded product by using afemto-second laser beam having a short wavelength. The surface of themolded product has a polar group, and hence the chemical adhesionstrength is expressed with respect to the plating film.

However, in the case of the method for forming the wiring pattern(electric circuit) by utilizing the laser beam as suggested in PatentDocument 1, the electroless plating catalyst strongly adheres to theportions other than the portion irradiated with the laser beam dependingon the type and the surface state of the base member, and theelectroless plating catalyst cannot be removed even by performing thewashing in some cases. For example, the electroless plating catalysteasily adheres to, for example, a base member which contains a fillerthat easily causes the adhesion of the electroless plating catalyst, abase member which has a large surface roughness, and a base member whichhas any void. Therefore, the electroless plating catalyst easily remainsthereon even when the washing is performed. Further, the electrolessplating catalyst permeates into the inside of the base member in somecases depending on the type of the electroless plating catalyst and thetype of the base member. It has been difficult to remove the electrolessplating catalyst having permeated into the base member by means of thewashing. Then, if the electroless plating is applied to the base memberin which the electroless plating catalyst remains at the portions otherthan the predetermined wiring pattern as described above, then anelectroless plating film is generated at the portions other than thewiring pattern as a matter of course, and any problem arises.

Further, in the case of the LDS method, it is necessary to develop anexclusively usable resin. A problem arises such that the cost of theresin material is greatly increased. Then, the resin is colored due tothe kneading of the large amount of the copper complex into the resin,and hence it has been difficult to apply the LDS method to transparentresins. Further, when the LDS method is applied, for example, to asheet-shaped thin-walled molded product, it has been difficult tomass-produce a variety of products in small amounts, because it isnecessary to use exclusively usable resins. Further, if it is intendedto apply the LDS method to the production of a large-sized part such asa substitute or replacement part for the cable harness of the automobileor the like, the following problem arises. At first, the amount of theexclusively usable resin material to be consumed is increased, and hencethe cost is raised. Then, it is necessary to realize a large-sized laserapparatus, which causes a problem in relation to the mass production.Further, the wiring patterns are adjacent to one another on an identicalsubstrate, and hence it is also feared that the insulation performancecan not be secured between the wiring patterns.

On the other hand, in Patent Document 3, it is investigated that themolded product surface is selectively plated without using any specialresin material. However, it is difficult to provide any distinctcontrast for the surface characteristic of the molded product betweenthe drawn portion and the other portions by means of only the laserdrawing. It is considered to be difficult to stably perform theselective plating by means of the method of Patent Document 3. Further,the method of Patent Document 3 requires an expensive short wavelengthlaser machining machine. This fact prohibits the widespread use of themethod.

The present teaching solves the problems as described above, whichprovides a method for producing a plated part wherein the method hardlydepends on the type, the shape, and the state of a base member, themethod inhibits the formation or generation of any electroless platingfilm at portions other than a predefined pattern in accordance with asimple and easy production process, and the electroless plating film canbe formed at only the predefined pattern.

SUMMARY OF THE INVENTION

According to a first aspect of the present teaching, there is provided amethod for producing a plated part, including: forming, on a surface ofa base member, a catalyst activity inhibiting layer (catalytic activityinhibiting layer) containing a polymer which has at least one of anamide group and an amino group; irradiating with light or heating a partof the surface of the base member on which the catalyst activityinhibiting layer is formed; applying an electroless plating catalyst tothe surface of the base member heated or irradiated with the light; andbringing an electroless plating solution into contact with the surfaceof the base member to which the electroless plating catalyst is applied,to form an electroless plating film at a light-irradiated portion or aheated portion of the surface.

In this aspect, the polymer may be a branched polymer having a sidechain. Further, the method for producing the plated part may furtherinclude washing the surface of the base member after the part of thesurface of the base member is heated or irradiated with the light andbefore the electroless plating solution is brought into contact with thesurface of the base member.

The branched polymer may be a dendritic polymer or a hyper-branchedpolymer. Further, the branched polymer may have a number averagemolecular weight of 3,000 to 30,000 and may have a weight averagemolecular weight of 10,000 to 300,000. The side chain of the branchedpolymer may contain an aromatic ring.

In this aspect, the branched polymer may further have a main chain. Themain chain of the branched polymer may be an aliphatic. The branchedpolymer may have a number average molecular weight of 1,000 to 100,000and may have a weight average molecular weight of 1,000 to 1,000,000.

The side chain of the branched polymer may have at least one of theamide group and the amino group. The side chain of the branched polymermay have a group containing sulfur. The group containing sulfur may be asulfide group or a dithiocarbamate group.

In this aspect, the branched polymer may be represented by the followingformula (1) or the following formula (3).

In the formula (1), A¹ is a group containing an aromatic ring, A² is agroup containing sulfur or an amino group, R¹ is a single bond or asubstituted or unsubstituted alkylene group having 1 to 5 carbon atoms,each of R² and R³ is hydrogen or a substituted or unsubstituted alkylgroup having 1 to 10 carbon atoms, and m1 is in a range of 1 to 10, andn1 is in a range of 5 to 100.

In the formula (3), R⁴ is hydrogen or a group selected from the groupconsisting of a substituted or unsubstituted alkyl group having 1 to 10carbon atoms, a group containing sulfur, an amino group, a carboxylgroup, an imide group, and a silane group, R⁵ is hydrogen or asubstituted or unsubstituted alkyl group having 1 to 10 carbon atoms,and n2 is in a range of 5 to 1,000.

The branched polymer may be represented by the formula (1), in theformula (1), A¹ may be a group represented by the following formula (2),A² may be a dithiocarbamate group, R¹ may be a single bond, R² may behydrogen, and R³ may be an isopropyl group.

The branched polymer may be represented by the formula (3), in theformula (3), R⁴ may be a methyl group or a group represented by thefollowing formula (4), and R⁵ may be an isopropyl group.

In this aspect, the polymer may have a main chain, and the main chainmay have at least one of the amide group and the amino group. The mainchain may further have an imide group.

In this aspect, the catalyst activity inhibiting layer may be removedfrom the light-irradiated portion or the heated portion of the surfaceby heating or irradiating with the light the part of the surface of thebase member. The heating or irradiating with the light the part of thesurface of the base member may be laser drawing performed on the surfaceof the base member by use of a laser beam.

According to a second aspect of the present teaching, there is provideda plated part, including: a base member; a plating film formed on a partof a surface of the base member; and a resin layer which is formed in anarea, of the surface of the base member, where the plating film is notformed and which contains a polymer having at least one of an amidegroup and an amino group.

The base member may be a resin or an insulating inorganic material. Theplated part may be an electronic part.

According to a third aspect of the present teaching, there is provided acatalyst activity inhibitor which inhibits catalyst activity of anelectroless plating catalyst, including a polymer which has at least oneof an amide group and an amino group.

According to a fourth aspect of the present teaching, there is provideda composite material for electroless plating, including: a base memberand a resin layer which is formed on a surface of the base member andwhich contains a polymer having at least one of an amide group and anamino group.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a flowchart illustrating a method for producing a plated partaccording to an embodiment.

FIGS. 2A to 2C explain the method for producing the plated partaccording to the embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENT

(1) Method for Producing Plated Part

An explanation will be made in accordance with a flowchart shown in FIG.1 about a method for producing a plated part (plated component) in whicha plating film having a predefined pattern is formed on a base member.At first, a catalyst activity inhibiting layer 11, which contains apolymer having at least one of an amide group and an amino group, isformed on a surface of a base member 10 shown in FIG. 2A (Step S1 inFIG. 1). The material of the base member 10 is not specifically limited.However, it is preferable to use an insulator in view of the formationof an electroless plating film on the surface. It is possible to use,for example, thermoplastic resin, thermosetting resin, photocurableresin, ceramics, and glass. Especially, the base member 10 to be used inthis embodiment is preferably a resin base member made by resin, in viewof the easiness of molding.

As for the thermoplastic resin, it is possible to use polyamidesincluding, for example, nylon 6 (PA6), nylon 66 (PA66), nylon 12 (PA12),nylon 11 (PA11), nylon 6T (PA6T), nylon 9T (PA9T), 10T nylon, 11T nylon,nylon MXD6 (PAMXD6), nylon 9T-6T copolymer, and nylon 6-66 copolymer. Asfor the resin other than polyamide, it is possible to use, for example,polypropylene, polymethyl methacrylate, polycarbonate, amorphouspolyolefin, polyether imide, polyethylene terephthalate, polyether etherketone, ABS-based resin, polyphenylene sulfide (PPS), polyamide imide,polylactic acid, polycaprolactone, liquid crystal polymer, andcycloolefin polymer.

In particular, when a plated part requiring the solder reflow resistanceis produced, it is preferable to use aromatic nylon such as nylon 6T(PA6T), nylon 9T (PA9T), 10T nylon, 11T nylon, nylon MXD6 (PAMXD6) andthe like and copolymers containing them, as the thermoplastic resinwhich is provided with both of the heat resistance and the moldability.Then, in view of the improvement in the dimension stability and therigidity, an inorganic filler such as a glass filler, a mineral filleror the like may be charged into the thermoplastic resin as describedabove. Specifically, it is possible to use, for example, Amodel (productname) produced by Solvay Advanced Polymers, Genestar (product name)produced by Kuraray, Vyloamide (product name) produced by Toyobo, andReny (product name) produced by Mitsubishi Engineering-Plastics Toyobo.Further, when the solder reflow resistance is not required for theplated part, it is possible to use, for example, a general purposeengineering plastic, such as ABS resin, polycarbonate (PC), and polymeralloy of ABS resin and PC (ABS/PC). When a high-frequency antenna isproduced as the plated part, it is preferable to use polyphenylenesulfide, liquid crystal polymer, and cycloolefin polymer, as thethermoplastic resin having electrical characteristics suitable for thehigh-frequency antenna. Further, when a commercially availablethermoplastic resin is used, it is allowable to use a blackthermoplastic resin which is commercially available as the black grade,in order that the heat is easily generated by absorbing the laser beamin the laser beam irradiation step as the aftertreatment step. Only onekind of the thermoplastic resin as described above may be used singly,or two or more kinds of the thermoplastic resins may be used incombination.

As for the thermosetting resin, it is possible to use, for example,silicone resin and epoxy resin. When a transparent thermosetting resinis used, it is thereby possible to produce a device (plated part) whichis transparent and which has the solder reflow resistance. As for thephotocurable resin, it is possible to use, for example, acrylic resin,silicone resin, epoxy resin, and polyimide. Further, as for theceramics, it is possible to use, for example, alumina, aluminum nitride,lead titanate zirconate (PZT), barium titanate, and silicon wafer.

In order that the heat is easily generated by absorbing the laser beamin the laser beam irradiation step as the aftertreatment step, the basemember 10 may contain, as a light absorbing agent, a filler such ascarbon and the like, and/or a light-absorbing coloring matter such ascyanine compound, phthalocyanine compound, dithiol metal complex,naphthoquinone compound, diimmonium compound, azo compound and the like.

The base member 10, which is used in this embodiment, may be acommercially available product. Alternatively, the base member may beproduced from a commercially available material by means of the moldingor the like. For example, it is also allowable to produce a ceramicsbase member having a complicated shape in accordance with the powderinjection molding method. Further, it is also allowable to produce aresin molded product (base member) by molding a commercially availablethermoplastic resin into a desired shape. As for the method for moldingthe thermoplastic resin, it is possible to use the general purposeinjection molding method and the extrusion molding method. The resinmolded product may be a sheet-shaped molded product produced by theextrusion molding. Further, the base member 10 may be shaped with a 3Dprinter by using a photocurable resin or a thermoplastic resin. When the3D printer is used, it is possible to produce the base member having acomplicated shape. It is possible to produce MID having a complicatedshape by using this base member.

The base member 10 used in this embodiment may be a foamed moldedproduct having foamed cells therein. Using the foamed molded product asthe base member 10 can produce lightweight MID having high precision insize. The foamed cells in the foamed molded product may be closed cellsor open cells. The foamed molded product can be produced by subjecting athermoplastic resin to foam molding by use of a chemical foaming agentor a physical foaming agent such as supercritical fluid.

The catalyst activity inhibiting layer 11 (hereinafter referred to as an“inhibiting layer” as appropriate) contains the polymer (hereinafterreferred to as an “amide group/amino group-containing polymer” asappropriate) having at least one of the amide group and the amino group.The amide group/amino group-containing polymer functions as a catalystactivity inhibitor that prevents (inhibits) or reduces the catalystactivity of an electroless plating catalyst to be applied on theinhibiting layer 11 in the aftertreatment step. The amide group/aminogroup-containing polymer functioning as the catalyst activity inhibitorcan uniformly cover the surface of the base member of different types asa resin layer (catalyst activity inhibiting layer), thus inhibiting anelectroless plating reaction at portions in which no plating filmformation is desired. The producing method of this embodiment thus has awide range for selecting the base member.

The amide group/amino group-containing polymer may be a polymer havingthe amide group only, may be a polymer having the amino group only, or apolymer having both the amide group and the amino group. The amidegroup/amino group-containing polymer may be any polymer, but in view ofthe inhibition of catalyst activity of the electroless plating catalyst,it is preferable to use the polymer having the amide group or a branchedpolymer having a side chain. In the branched polymer, the side chainpreferably contains at least one of the amide group and the amino group,more preferably contains the amide group.

Although the mechanism, in accordance with which the amide group/aminogroup-containing polymer inhibits the catalyst activity of theelectroless plating catalyst, is not clear, it is assumed, as follows.The amide group and/or amino group form(s) a composite(s) throughadsorption, coordination, reaction, or the like with respect to theelectroless plating catalyst, which causes the electroless platingcatalyst to be trapped by the amide group/amino group-containingpolymer. In particular, the amide group and/or the amino group in theside chain of the branched polymer has/have a lot of flexibility, andmany amide groups and/or amino groups can be contained in a molecule ofthe branched polymer. Thus, in the branched polymer, multiple amidegroups and/or amino groups can efficiently and strongly trap theelectroless plating catalyst. For example, the branched polymerfunctions as a multidentate ligand, multiple amide groups and/or aminogroups can be coordinated with the electroless plating catalyst, andthus forming a chelate structure. The electroless plating catalysttrapped as described above can not exhibit the catalyst activity. Forexample, when metal such as palladium is applied, as the electrolessplating catalyst, on the inhibiting layer 11, the amide groups and/oramino groups of the branched polymer trap the palladium in a state ofpalladium ion. The palladium ion becomes metallic palladium by beingreduced by a reducing agent contained in an electroless platingsolution, and the metallic palladium exhibits the electroless platingcatalyst activity. The palladium ion trapped by the branched polymer,however, is not reduced by the reducing agent contained in theelectroless plating solution, and thus can not exhibit the catalystactivity. This inhibits the formation of the electroless plating film onthe surface of the base member 10 on which the inhibiting layer 11 isformed. This mechanism, however, is just an assumption, and the presentteaching is not limited to this.

The amide group in the amide group/amino group-containing polymer is notspecifically limited, and may be any of a primary amide group, asecondary amide group, and a tertiary amide group. The amino group inthe amide group/amino group-containing polymer is not specificallylimited, and may be any of a primary amino group, a secondary aminogroup, and a tertiary amino group. The polymer may contain one kind ofthe amide group and/or one kind of the amino group, or may contain twoor more kinds of the amide groups and/or two or more kinds of the aminogroups.

When the branched polymer is used as the amide group/aminogroup-containing polymer, the amide group in the branched polymer may bethe secondary amide group, and an isopropyl group is preferably bondedto nitrogen of the amide group in order to efficiently inhibit thecatalyst activity of the electroless plating catalyst. The amino groupin the branched polymer is preferably the primary amino group (—NH₂) orthe secondary amino group (—NH—).

The side chain of the branched polymer has at least one of the amidegroup or the amino group. Further, the side chain may have a groupcontaining sulfur. Similar to the amide group and the amino groupdescribed above, the group containing sulfur tends to, for example,adsorb the electroless plating catalyst. This facilitates the effect inwhich the branched polymer inhibits the catalyst activity of theelectroless plating catalyst. The group containing sulfur is notspecifically limited, and is, for example, sulfide group,dithiocarbamate group, and thiocyanate group. The group containingsulfur is preferably the sulfide group or the dithiocarbamate group. Theside chain of the branched polymer may contain only one kind of thegroup containing sulfur as described above or two or more kinds of thegroups containing sulfur.

The branched polymer is preferably a dendritic polymer. The dendriticpolymer is a polymer having a molecular structure that frequentlyrepeats regular branching. The dendritic polymer is classified into adendrimer and a hyper-branched polymer. The dendrimer, which is aspherical polymer having a diameter of several nanometers, has adendritic branched structure that is branched regularly and completelywith a molecule, which is a nucleus, as a center. The hyper-branchedpolymer, which is a polymer having an uncomplete dendritic branchedstructure, is different from the dendrimer having the complete dendriticbranched structure. The hyper-branched polymer is more inexpensive andrelatively easier to be synthesized or composed than the dendrimer. Thehyper-branched polymer is thus preferably used as the branched polymerin this embodiment.

In this embodiment, a portion(s) except for the molecule that is thenucleus of each of the dendrimer and the hyper-branched polymer is/aredefined as the side chain(s) of each of the dendrimer and thehyper-branched polymer. Each of the dendrimer and the hyper-branchedpolymer used in this embodiment thus has at least one of the amide groupand the amino group in each side chain, namely, in the portion exceptfor the molecule that is the nucleus. The dendritic polymer, which hasmany side chains having a lot of flexibility, is easily adsorbed to theelectroless plating catalyst, thus making it possible to efficientlyinhibit the catalyst activity of the electroless plating catalyst. Thisallows the dendritic polymer to efficiently function as the catalystactivity inhibitor after the dendritic polymer is made to become a thinfilm. Further, a solution of the dendritic polymer has low viscosityeven when the solution has high concentration. The solution is thuscapable of forming the inhibiting layer having a uniform thickness on abase member having a complicated shape. Further, since the dendriticpolymer has satisfactory heat resistance, the dendritic polymer issuitable for the plated part requiring the solder reflow resistance.

In addition to the amide group and/or the amino group, the dendriticpolymer may contain a functional group having high affinity for the basemember. This strengthens an adhesion property between the base member 10and the inhibiting layer 11 shown in FIGS. 2A to 2C. The functionalgroup having high affinity for the base member can be appropriatelyselected depending on the type of the base member. For example, when thebase member is a material having an aromatic ring, such as polyphenylenesulfide and liquid crystal polymer, the dendritic polymer preferablycontains the aromatic ring. When the base member is glass, the dendriticpolymer preferably contains a silanol group having high affinity forglass.

In the dendritic polymer of this embodiment, the number averagemolecular weight is preferably in a range of 3,000 to 30,000, morepreferably in a range of 5,000 to 30,000, and the weight averagemolecular weight is preferably in a range of 10,000 to 300,000, morepreferably in a range of 20,000 to 200,000. When the number averagemolecular weight and the weight average molecular weight are smallerthan the above ranges, the quantity or amount of the functional groupper one molecule may decrease, which may reduce the efficiency as thecatalytic activity inhibitor. Meanwhile, the number average molecularweight and the weight average molecular weight may be larger than theabove ranges. In that case, for example, when a producing method, inwhich the catalyst activity inhibiting layer 11 is formed by dissolvingthe dendritic polymer in a solvent, is used, solubility of the dendriticpolymer in the solvent may be unsatisfactory, which may cause adisadvantage in production.

The dendritic polymer of this embodiment is preferably a branchedpolymer represented by the following formula (1). The branched polymerrepresented by the formula (1) efficiently functions as the catalyticactivity inhibitor.

In the formula (1), A¹ is a group containing an aromatic ring, A² is agroup containing sulfur or an amino group, R¹ is a single bond or asubstituted or unsubstituted alkylene group having 1 to 5 carbon atoms,R² and R³ may be identical with each other or different from each other,and each of R² and R³ is hydrogen or a substituted or unsubstitutedalkyl group having 1 to 10 carbon atoms. Each of R¹, R², and R³ may havea straight chain or a branched chain. Further, m1 is in a range of 1 to10, and n1 is in a range of 5 to 100.

In the formula (1), A¹ is preferably a group represented by thefollowing formula (2), A² is a preferably a dithiocarbamate group, R¹ ispreferably a single bond, R² is preferably hydrogen, and R³ ispreferably an isopropyl group.

The branched polymer of this embodiment may be any other branchedpolymer than the dendritic polymer. In that case, the branched polymerhas a main chain in addition to the side chain. In the branched polymerhaving the main chain and the side chain, the main chain may contain theamide group and/or the amino group, or the side chain may contain theamide group and/or the amino group. In view of the inhibition of thecatalyst activity of the electroless plating catalyst, the side chainpreferably contains the amide group and/or the amino group. The mainchain of the branched polymer may contain a functional group having highaffinity for the base member. This strengthens the adhesion propertybetween the base member 10 and the inhibiting layer 11 shown in FIGS. 2Ato 2C. When the branched polymer contains the main chain and the sidechain, the main chain preferably has an adhesion-property improvingfunction between the base member 10 and the inhibiting layer 11 bycontaining the functional group having high affinity for the basemember, and the side chain preferably has a catalyst-activity inhibitingfunction by containing the amide group and/or the amino group. It isassumed that distinguishing the functions from each other enhances theflexibility of the side chain having the amide group and/or amino group,making it easy for the branched polymer to trap the electroless platingcatalyst. Similar to the dendritic polymer as described above, thefunctional group having high affinity for the base member can beappropriately selected depending on the type of the base member.

In the branched polymer having the main chain and the side chainaccording to this embodiment, the number average molecular weight ispreferably in a range of 1,000 to 100,000, more preferably in a range of5,000 to 50,000, and the weight average molecular weight is preferablyin a range of 1,000 to 1,000,000, more preferably in a range of 5,000 to200,000. When the number average molecular weight and the weight averagemolecular weight are smaller than the above ranges, the quantity oramount of the functional group per one molecule may decrease, which mayreduce the efficiency as the catalytic activity inhibitor. Meanwhile,the number average molecular weight and the weight average molecularweight may be larger than the above ranges. In that case, for example,when a producing method, in which the catalyst activity inhibiting layer11 is formed by dissolving the branched polymer in a solvent, is used,solubility of the branched polymer in the solvent may be unsatisfactory,which may cause a disadvantage in production.

The branched polymer having the main chain and the side chain accordingto this embodiment may be an acrylamide-based resin, preferably abranched polymer represented by the following formula (3). The branchedpolymer represented by the formula (3) efficiently functions as thecatalytic activity inhibitor.

In the formula (3), R⁴ is hydrogen or a group selected from the groupconsisting of a substituted or unsubstituted alkyl group having 1 to 10carbon atoms, a group containing sulfur, an amino group, a carboxylgroup, an imide group, and a silane group, R⁵ is hydrogen or asubstituted or unsubstituted alkyl group having 1 to 10 carbon atoms.Each of R⁴ and R⁵ may have a straight chain or a branched chain.Further, n2 is in a range of 5 to 1,000.

In the formula (3), R⁴ is preferably a methyl group or a grouprepresented by the following formula (4), and R⁵ is preferably anisopropyl group.

The amide group/amino group-containing polymer used in this embodimentmay be any other polymer than the branched polymer, provided that thepolymer has the amide group and/or the amino group. Namely, the amidegroup/amino group-containing polymer may be a straight-chain polymerthat has no side chain but has the main chain, and the main chain of thestraight-chain polymer may have at least one of the amide group and theamino group. The main chain of the amide group/amino group-containingpolymer may further have an imide group. Similar to the amide group andamino group described above, the imide group tends to, for example,adsorb the electroless plating catalyst. This facilitates the effect ofinhibiting the catalyst activity of the electroless plating catalyst.The polymer having the imide group is exemplified, for example, bypolyamideimide.

In addition to the amide group/amino group-containing polymer, theinhibiting layer 11 may contain, as a light absorbing agent, a fillersuch as carbon, and/or a light-absorbing coloring matter such as cyaninecompound, phthalocyanine compound, dithiol metal complex, naphthoquinonecompound, diimmonium compound, and azo compound, in order to easilygenerate the heat by absorbing the laser beam in the laser beamirradiation step as the aftertreatment step. The light absorbing agentmay be dissolved or dispersed in a solvent or the like, which may beapplied to a surface of the inhibiting layer 11. It is preferable thatthe light absorbing agent is previously contained in the inhibitinglayer 11 in view of the simplicity and convenience of the operation.

The inhibiting layer 11 may not contain any other polymer than the amidegroup/amino group-containing polymer, or may contain, together with theamide group/amino group-containing polymer, any other polymer that doesnot inhibit the catalyst activity. Although the inhibiting layer 11preferably does not contain any other polymer than the amide group/aminogroup-containing polymer in view of the catalyst activity inhibition,the inhibiting layer 11 may contain any other polymer to improve othercharacteristics, such as the adhesion property between the inhibitinglayer 11 and the base member 10. Further, the inhibiting layer 11 maycontain, as needed, a publicly known additive such as a surfactant.

The amide group/amino group-containing polymer is preferably a maincomponent of the inhibiting layer 11. The inhibiting layer 11 contains,for example, 30 to 100% by weight of the amide group/aminogroup-containing polymer, preferably 50 to 100% by weight of the amidegroup/amino group-containing polymer, more preferably 70 to 100% byweight of the amide group/amino group-containing polymer. When theinhibiting layer 11 contains the amide group/amino group-containingpolymer in each of the above ranges, the inhibiting layer 11 cansatisfactorily inhibit generation or formation of the plating film onthe base member 10.

The inhibiting layer 11 is preferably thin so that the inhibiting layer11 has no influence on physical properties such as heat resistance andelectronic properties such as permittivity, of the base member 10. Forexample, the thickness of the inhibiting layer 11 is preferably equal toor less than 5,000 nm, more preferably equal to or less than 1,000 nm,further more preferably equal to or less than 300 nm. In view of theinhibition of the catalyst activity of the electroless plating catalyst,for example, the thickness of the inhibiting layer 11 is preferablyequal to or more than 10 nm, more preferably equal to or more than 30nm, further more preferably equal to or more than 50 nm. In order toinhibit formation of the electroless plating film at portions other thanthe predefined pattern, the inhibiting layer 11 is preferably formed inat least an area, of the surface of the base member 10, which comes intocontact with the electroless plating solution in the electroless platingstep as the aftertreatment step, more preferably formed on the entiresurface of the base member 10.

The method of forming the inhibiting layer 11 on the surface of the basemember 10 is not specifically limited. For example, the inhibiting layer11 may be formed by preparing a polymer solution obtained by dissolvingor dispersing the amide group/amino group-containing polymer in asolvent, and then coming the polymer solution into contact with the basemember 10. The method of coming the polymer solution into contact withthe base member 10 may be a method of coating the base member 10 withthe polymer solution, or a method of immersing the base member 10 in thepolymer solution. Specifically, the method of forming the inhibitinglayer 11 includes, for example, dip coating, screen coating, and spraycoating. In view of uniformity of the inhibiting layer 11 formed andsimplicity and convenience of the operation, the method of immersing thebase member 10 in the polymer solution (dip coating) is preferably used.

When the polymer solution is used for forming the inhibiting layer 11,the blending amount of the amide group/amino group-containing polymer inthe polymer solution (the concentration of the amide group/aminogroup-containing polymer) is not specifically limited, and can beappropriately determined in view of the type of the amide group/aminogroup-containing polymer, the type of the solvent, the molecular weightof the amide group/amino group-containing polymer, the film thickness ofthe inhibiting layer 11 formed, and the like. The blending amount of theamide group/amino group-containing polymer in the polymer solution is,for example, in a range of 0.01 to 5% by weight, or preferably in arange of 0.1 to 2% by weight.

The solvent (medium) used for the polymer solution is not specificallylimited, provided that the amide group/amino group-containing polymercan be dissolved or dispersed therein and the solvent does not changethe quality of the base member 10. It is preferably to use, for example,ketones such as methyl ethyl ketone and methyl isobutyl ketone; alcoholssuch as ethanol, methanol, and isopropyl alcohol; glycol ethers such asdipropylene glycol monomethylether and 2-butoxy ethanol; compoundshaving an aromatic ring such as toluene and benzene; N-methylpyrrolidone; cyclohexanone; tetrahydrofuran; and mixtures thereof. Inaddition to the amide group/amino group-containing polymer and thesolvent, the polymer solution may contain, as needed, a publicly knownadditive such as the light absorbing agent described above, anotherpolymer, and a surfactant. The polymer solution can be prepared bymixing the above-described components or ingredients through aconventionally known method.

The temperature and immersion time of the polymer solution when the basemember 10 is immersed in the polymer solution are not specificallylimited, and can be appropriately determined in view of the type of theamide group/amino group-containing polymer, the type of the solvent, themolecular weight of the amide group/amino group-containing polymer, thefilm thickness of the inhibiting layer formed, and the like. Thetemperature of the polymer solution is, for example, in a range of 0 to100° C., preferably in a range of 10 to 50° C. The immersion time is,for example, in a range of one second to 10 minutes, preferably in arange of five seconds to two minutes.

Performing the above-explained step (Step S1 in FIG. 1) results in acomposite material 50 for electroless plating including the base member10 and the resin layer 11 which is formed on the surface of the basemember 10 and contains the amide group/amino group-containing polymer,shown in FIG. 2A. The electroless plating film can be selectively formedat a portion irradiated with the laser beam by subjecting the compositematerial 50 to electroless plating (Step S4) after performing the laserbeam irradiation step (Step S2 in FIG. 1), anelectroless-plating-catalyst application step (Step S3), and the like,those of which are described below.

Subsequently, energy is applied to a surface of the composite material50 obtained, namely, to a part of the surface of the base member 10 onwhich the inhibiting layer 11 is formed. The energy application isperformed by light irradiation or heating (Step S2 in FIG. 1). Themethod for radiating the light is not specifically limited, which isexemplified by a method in which a laser beam is radiated onto thesurface of the base member 11 in accordance with a predefined pattern(laser drawing) and a method in which a portion to be not irradiatedwith light is masked, and then the entire surface of the base member 11is irradiated with light. It is speculated that the light is convertedinto the heat by irradiating the part of the surface of the base member10 with the light, and the surface of the base member 10 is heated. Asdescribed above, when the base member 10 contains the light absorbingagent, the light, which is radiated onto the base member 10, can beefficiently converted into the heat. Further, the method for heating thesurface of the base member 10 without radiating any light onto thesurface of the base member 10 is exemplified, for example, by a methodin which the surface of the base member 10 is directly thermally pressedwith a simple and elementary mold or the like having a pattern formed byprotrusions. In view of the simplicity and convenience of the operation,the selectivity of the heated portion, the easiness of pattern change,and the easiness of making the pattern fine, it is preferable to heatthe base member 10 by means of the laser drawing.

The laser beam can be radiated by using a laser apparatus including, forexample, a CO₂ laser, a YVO₄ laser, and a YAG laser. The laserapparatuses as described above can be appropriately selected dependingon the type of the amide group/amino group-containing polymer used forthe inhibiting layer 11.

In this embodiment, the portion irradiated with the laser beam is heatedby radiating the laser beam onto the surface of the base member 10 inaccordance with the predefined pattern (laser drawing), and theinhibiting layer 11 existing at the heated portion is removed. In thiscase, the phrase “removal of the inhibiting layer 11” means, forexample, such a situation that the inhibiting layer 11 existing at theheated portion disappears on account of the evaporation. When the laserdrawing of the predefined pattern is performed on the surface of thebase member 10 applied with the inhibiting layer 11, it is therebypossible to form an inhibiting layer-removed portion 10 a which has thepredefined pattern and an inhibiting layer-remaining portion 10 b inwhich the inhibiting layer 11 remains. Note that a surface layer portionof the base member 10 may evaporate and disappear together with theinhibiting layer 11 at the inhibiting layer-removed portion 10 a that isthe heated portion. Further, the phrase “removal of the inhibiting layer11” includes not only the complete disappearance of the inhibiting layer11 but also a case in which the inhibiting layer 11 remains to such anextent that no influence is exerted on the progress of the electrolessplating treatment to be performed in the aftertreatment step. Even whenthe inhibiting layer 11 remains, if no influence is exerted on theelectroless plating treatment to be performed in the aftertreatmentstep, then the function to inhibit the catalyst activity of theelectroless plating catalyst disappears. Further, in this embodiment,the situation, in which the inhibiting layer 11 existing at the heatedportion is denatured or modified in quality and the inhibiting layer 11does not function as the inhibiting layer 11, is also included in the“removal of the inhibiting layer 11”. This situation is exemplified, forexample, by such a situation in which the amide group and/or the aminogroup of the amide group/amino group-containing polymer is/are denaturedor modified in quality, making it impossible for the amide group/aminogroup-containing polymer to trap the electroless plating catalyst. Inthis case, the inhibiting layer 11 existing at the heated portion doesnot disappear completely, and any denatured matter (modified matter)remains. The denatured matter, however, does not inhibit the catalystactivity. Therefore, the portion, at which the inhibiting layer 11 isdenatured or modified in quality, also provides the function which isthe same as or equivalent to that of the inhibiting layer-removedportion 10 a at which the inhibiting layer 11 disappears.

In this embodiment, the surface of the base member 10 is preferablywashed after the laser beam irradiation. When the denatured matter(modified matter) of the inhibiting layer 11 remains at the inhibitinglayer-removed portion 10 a due to the laser beam irradiation, thedenatured matter (modified matter) may widely fly or scatter over thesurface of the base member 10. This denatured matter (modified matter)does not inhibit the catalyst activity. Thus, when the denatured matter(modified matter) adheres to the inhibiting layer-remaining portion 10b, the plating film is formed or generated at the portion to which thedenatured matter (modified matter) adheres, at the time of electrolessplating as the aftertreatment step. The denatured matter (modifiedmatter) scattering over the surface of the base member 10 can be removedby washing the surface of the base member 10 after the laser beamirradiation. This inhibits formation of the plating film at portionsother than the portion irradiated with the laser beam, improving platingselectivity. The washing of the surface of the base member 10 ispreferably performed after the step in which the part of the surface ofthe base member 10 is heated or irradiated with the light (Step S2 inFIG. 1) and before the step in which the electroless plating solution isbrought into contact with the surface of the base member 10 (Step S4 inFIG. 1). The washing of the surface of the base member 10 may beperformed before or after the electroless-plating-catalyst applicationstep (Step S3 in FIG. 1) provided that the washing is performed afterthe step of heating the surface of the base member 10 or the like (StepS2 in FIG. 1) and before the electroless plating step (Step S4 in FIG.1). In view of the plating selectivity improvement, the washing of thesurface of the base member 10 is preferably performed before theelectroless-plating-catalyst application step.

The method of washing the surface of the base member 10 may be anymethod provided that the denatured matter (modified matter) of theinhibiting layer 11 scattering over the surface of the base member 10can be removed. For example, the base member 10 irradiated with thelaser beam may be immersed in a wash solution in which the denaturedmatter (modified matter) of the inhibiting layer 11 is dissolvable(immersion method). As the wash solution, it is possible to use apretreatment agent for plating such as a defatting agent, a surfaceconditioner, and a conditioner; a surfactant solution; an alkalinesolution; and the like.

Subsequently, the electroless plating catalyst is applied to the surfaceof the base member 10 irradiated with the laser beam (Step S3 in FIG.1). Any arbitrary catalyst can be used as the electroless platingcatalyst, provided that the catalyst has the ability of the electrolessplating catalyst. However, it is possible to use, for example, metalfine particles, metal complexes, and metal alkoxides of, for example,Pd, Ni, Pt, and Cu. Especially, it is preferable to use the electrolessplating catalyst containing Pd which has the high catalytic activity.

The method for applying the electroless plating catalyst to the surfaceof the base member 10 is not specifically limited. The electrolessplating catalyst may be applied to the surface of the base member 10,for example, by preparing a catalyst solution in which the electrolessplating catalyst is dissolved or dispersed in a solvent, and coating thebase member 10 with the catalyst solution or immersing the base member10 in the catalyst solution. In view of the uniformity or homogeneity ofthe application of the catalyst, it is preferable to use the method inwhich the base member 10 is immersed in the catalyst solution.

The solvent, which is used for the catalyst solution, is notspecifically limited, provided that the catalyst can be dissolved ordispersed in the solvent. However, for example, it is possible to usewater, alcohol such as methanol, ethanol, propyl alcohol, isopropylalcohol, and butanol, and hydrocarbon such as hexane and heptane. As forthe hydrocarbon, it is also allowable to use, for example, acommercially available high boiling point solvent (Isopar (productname), produced by Exxon Mobil Corporation). As for the electrolessplating catalyst to be used for the catalyst solution, it is preferableto use a palladium complex in view of the high plating catalyticactivity. Specifically, it is possible to use, for example, sodiumtetrachloropalladate, potassium tetrachloropalladate, palladium acetate,palladium chloride, acetylacetonatopalladium (II), andhexafluoroacetylacetonatopalladium (II) metal complex. The blendingamount (catalyst concentration) of the electroless plating catalyst inthe catalyst solution can be, for example, in a range of 0.01 to 5% byweight.

Another method for applying the electroless plating catalyst to thesurface of the base member 10 is exemplified by a general purpose methodin which a commercially-available electroless plating catalyst solutionis used, including, for example, a sensitizer-activator method and acatalyzer-accelerator method. In the sensitizer-activator method, thesurface of the base member 10 is firstly treated, for example, with asolution containing Sn²⁺ (sensitizer treatment) in order that theelectroless plating catalyst easily adsorbs. Subsequently, the basemember 10 is immersed in a solution containing the electroless platingcatalyst (for example, Pd²⁺) (activator treatment). In thecatalyzer-accelerator method, the base member 10 is firstly immersed ina solution containing the electroless plating catalyst (for example, apalladium colloid solution obtained by mixing Sn²⁺ and Pd²⁺) (catalyzertreatment). Subsequently, the base member 10 is immersed, for example,in a hydrochloric acid solution to deposit the metal of the platingcatalyst on the surface of the base member 10 (accelerator treatment).

Subsequently, the electroless plating solution is brought into contactwith the surface of the base member 10 (Step S4 in FIG. 1). Accordingly,an electroless plating film 85 can be formed at the heated portion ofthe surface of the base member 10, and it is possible to produce aplated part 100 in which the plating film is selectively formed. Anarbitrary general-purpose electroless plating solution can be used asthe electroless plating solution depending on the object. However, inview of the fact that the catalytic activity is high and the solution isstable, it is preferable to use an electroless nickel phosphorus platingsolution, an electroless copper plating solution, and an electrolessnickel plating solution.

An electroless plating film of a different type may be further formed onthe electroless plating film 85, or an electroplating film may be formedthereon by means of the electroplating. When the total thickness of theplating film on the base member 10 is thickened, it is thereby possibleto decrease the electric resistance when the plating film having thepredefined pattern is used as an electric circuit. In view of thedecrease in the electric resistance of the plating film, the platingfilm, which is stacked on the electroless plating film 85, ispreferably, for example, an electroless copper plating film, anelectroplating copper film, and an electroplating nickel film. Further,the electroplating cannot be performed for an electrically isolatedcircuit. Therefore, in such a situation, it is preferable that the totalthickness of the plating film on the base member 10 is thickened bymeans of the electroless plating. Further, in order to improve thesolder wettability of the plating film pattern so that it is possible torespond to the solder reflow, it is also appropriate that a plating filmof stannum, gold, silver or the like is formed on the outermost surfaceof the plating film pattern.

In this embodiment, the inhibiting layer-remaining portion 10 b in whichthe inhibiting layer 11 remains and the inhibiting layer-removed portion10 a having the predefined pattern and from which the inhibiting layer11 is removed by the heating, exist on the surface of the base member10. Then, the electroless plating catalyst is applied to the surface ofthe base member 10 and the electroless plating solution is brought intocontact therewith. Thus, the electroless plating film 85 can be formedat only the inhibiting layer-removed portion 10 a having the predefinedpattern. In this embodiment, the formation of the plating film isinhibited at portions other than the predefined pattern and the platingfilm 85 can be formed only at the predefined pattern in accordance withthe simple and easy production process with respect to the base memberof various materials.

The method for producing the plated part according to this embodimentdescribed above uses the amide group/amino group-containing polymer asthe catalyst activity inhibitor. Thus, the surface of the base member ofdifferent types can be coated uniformly with the resin layer of thecatalyst activity inhibitor (catalyst activity inhibiting layer),inhibiting the electroless plating reaction at portions at which noplating film formation is desired. The producing method of thisembodiment thus has a wide range for selecting the base member. Forexample, the inhibiting layer having a uniform thickness can be formedon a surface of a base member having a large surface roughness, asurface of a base member having a void, a surface of a foamed moldedproduct having a foam mark on the surface thereof, and the like.Accordingly, in the method for producing the plated part having a widerange for selecting the base member according to this embodiment, anythree-dimensional circuit formed product having a shape of anythin-walled sheet and any optical member including, for example, lensesand spectacles, those of which have been hitherto difficult to beproduced, can be produced in accordance with the simple and easy method.

In conventional electroless plating methods, when the step of applyingthe electroless plating catalyst and the electroless plating step areperformed continuously without replacement of a fixing jig that fixesthe base member, a problem in which the electroless plating film isformed on the fixing jig has occurred. This embodiment can solve thatproblem by forming the catalyst activity inhibiting layer not only onthe base member but also on the fixing jig for the base member in thestep of forming the catalyst activity inhibiting layer on the basemember (Step S1 in FIG. 1). Namely, the catalyst activity inhibitinglayer formed on the fixing jig inhibits the formation of the electrolessplating film. This improves the manufacturing efficiency of the platedpart without requiring the replacement of fixing jig for the basemember.

In the present teaching, the electroless plating film is formed at theheated portion or the light-irradiated portion of the base membersurface, while the generation or formation of the electroless platingfilm is inhibited on account of the presence of the catalyst activityinhibiting layer at the portions other than the above. Accordingly, inthe method for producing the plated part of the present teaching, thegeneration of the electroless plating film is inhibited at the portionsother than the predefined pattern in accordance with the simple and easyproduction process, and it is possible to form the electroless platingfilm at only the predefined pattern. Further, in the method of thepresent teaching, the range of selection of the base member is wide, andit is also possible to reduce the production cost.

(2) Plated Part

FIG. 2C shows the plated part 100 produced in this embodiment in whichthe plating film is selectively formed. The plated part 100 includes thebase member 10, the plating film 85 formed on a part of the surface ofthe base member 10, and the catalyst activity inhibiting layer (resinlayer) 11 formed in an area, of the surface of the base member, wherethe plating film 85 is not formed. The plating film 85 may form thepredefined pattern on the surface of the base member 10. In that case,the catalyst activity inhibiting layer (resin layer) 11 is formed onportions, of the surface of the base member 10, where no predefinedpattern exists.

The catalyst activity inhibiting layer 11 is a resin layer containingthe amide group/amino group-containing polymer. The main component ofthe inhibiting layer is the amide group/amino group-containing polymer.The inhibiting layer 11 contains, for example, 30 to 100% by weight ofthe amide group/amino group-containing polymer, preferably 50 to 100% byweight of the amide group/amino group-containing polymer, and morepreferably 70 to 100% by weight of the amide group/aminogroup-containing polymer. For example, the film thickness of thecatalyst activity inhibiting layer 11 is preferably equal to or lessthan 5,000 nm, more preferably equal to or less than 1,000 nm, and morepreferably equal to or less than 300 nm. In view of the inhibition ofcatalyst activity of the electroless plating catalyst, for example, thefilm thickness of the catalyst activity inhibiting layer 11 ispreferably equal to or more than 10 nm, more preferably equal to or morethan 30 nm, and further more preferably equal to or more than 50 nm.

The plating film 85 having the predefined pattern may have conductivity.In that case, the plating film 85 having the predefined patternfunctions, for example, as an electrical wiring pattern, an electriccircuit, or an antenna pattern, and the plated part 100 having theplating film 85 with the predefined pattern functions as an electronicpart (electronic component) including a circuit part or an antenna.Further, the plating film 85 having the predefined pattern may be formedin a planar form on only one surface of the base member 10.Alternatively, the plating film 85 having the predefined pattern may beformed three-dimensionally over surfaces of the base member 10 or alonga surface of a three-dimensional shape including, for example, aspherical surface. When the plating film 85 having the predefinedpattern is formed three-dimensionally over the surfaces of the basemember 10 or along the surface of the three-dimensional shape including,for example, the spherical surface, and the plating film 85 having thepredefined pattern has the conductivity, then the plating film 85 havingthe predefined pattern functions as a three-dimensional electric circuitor a three-dimensional antenna, and the plated part 100 having theplating film 85 with the predefined pattern as described above functionsas a three-dimensional circuit formed part (MID) or an MID antenna.

When the pattern including the plating film 85 functions as theelectrical wiring pattern, the catalyst activity inhibiting layer 11exists between adjoining electrical wirings. This catalyst activityinhibiting layer 11 improves the insulating performance between theelectrical wirings, raising the wiring density of the electronic part.The electronic part has a problem, called migration, in which metallicions are discharged from electrical wirings due to voltage application.In the plated part 100 of this embodiment, it is possible to expect thatthe catalyst activity inhibiting layer 11 provided between the adjoiningelectrical wirings traps the metallic ions discharged from theelectrical wirings to prevent a short circuit between the wirings.Further, when the pattern including the plating film 85 is the antennapattern, the catalyst activity inhibiting layer 11, which is theinsulator provided in an area except for the antenna pattern, improvesantenna performance.

Modified Embodiment

As shown in FIG. 2C, the plated part 100 produced in this embodimentdescribed above includes the catalyst activity inhibiting layer 11containing the amide group/amino group-containing polymer. Thisembodiment, however, is not limited thereto. The producing method ofthis embodiment may further include a step of removing the inhibitinglayer 11 from the surface of the base member 10. In this modifiedembodiment, the catalyst activity inhibiting layer 11 is removed fromthe base member 10 after the step of applying the electroless platingcatalyst to the surface of the base member 10 (Step S3 in FIG. 1) orafter the step of forming the electroless plating film 85 (Step S4 inFIG. 1). Thus, the plated part produced in this modified embodiment,which does not include the inhibiting layer 11, is different from theplated part 100 shown in FIG. 2C.

The method of removing the inhibiting layer 11 from the base member 10is exemplified by a method in which the base member 10 is washed with awashing solution so that the amide group/amino group-containing polymeris eluted in the washing solution and thereby the amide group/aminogroup-containing polymer is removed. The washing solution is notspecifically limited, provided that the amide group/aminogroup-containing polymer is dissolved in the washing solution and thebase member 10 is not denatured or modified in quality by the washingsolution. The washing solution can be appropriately selected dependingon the type of the base member 10 and the type of the amide group/aminogroup-containing polymer. For example, it is possible to use the samesolution (media) as that used for the polymer solution described above.

EXAMPLES

In the following, the present teaching will be specifically explainedwith reference to Examples and Comparative Examples. However, thepresent teaching is not limited to or restricted by Examples andComparative Examples described below. Note that formulae (5) to (10)representing the chemical structures of Polymers A to F used inExperiments 1 to 26 will be summarily described after the explanation ofExperiment 26.

<Experiment 1>

In Experiment 1, Polymer A represented by a formula (5) is used as theamide group/amino group-containing polymer contained in the catalystactivity inhibiting layer.

(1) Synthetization of Polymer A

Amid groups were introduced to a commercially available hyper-branchedpolymer (Polymer D) to thereby synthesize Polymer A represented by theformula (5). Polymer A represented by the formula (5) is a polymerrepresented by the formula (1); in the formula (1), A¹ is a grouprepresented by the formula (2), A² is a dithiocarbamate group, R¹ is asingle bond, R² is hydrogen, and R³ is an isopropyl group.

At first, a hyper-branched polymer (HYPERTECH HPS-200 produced by NISSANCHEMICAL CORPORATION; 1.3 g, dithiocarbamate group: 4.9 mmol),N-isopropyl acrylamide (NIPAM) (1.10 g, 9.8 mmol),α-α′-azobisisobutyronitrile (AIBN) (81 mg, 0.49 mmol), and dehydratedtetrahydrofuran (THF) were added to a Schlenk flask, followed by beingsubject to freeze-deaeration three times. Afterwards, an oil bath wasused to agitate and subject the mixture inside the Schlenk flask toreaction at 70° C. for one night (18 hours). After the completion of thereaction, the mixture was cooled with iced water, and was dilutedappropriately by THF. Next, the mixture was subjected tore-precipitation in hexane; a solid product obtained thereby wassubjected to vacuum drying at 60° C. for one night. The NMR (NuclearMagnetic Resonance) and IR (InfraRed absorption spectrum) of thegenerated product were measured. From the results of the measurements,it was confirmed that the amid groups were introduced into thecommercially available hyper-branched polymer represented by the formula(8), which in turn generated Polymer A represented by the formula (5).Next, the molecular weight of the generated product was measured by aGPC (Gel Permeation Chromatography). The molecular weight was:number-average molecular weight (Mn)=9,946; whereas weight-averagemolecular weight (Mw)=24,792, which were values, unique to thehyper-branched structure, that the number-average molecular weight (Mn)was greatly different from the weight-average molecular weight (Mw). Theyield of Polymer A was 92%.

(2) Molding of Resin Molded Product (Base Member)

A general-purpose injection molding apparatus (J180AD-300H produced byJAPAN STEEL WORKS, LTD.) was used to mold a glass fiber-enhancedpolyphenylene sulfide (PPS) (1040G, black color, produced by TEIJINLIMITED) into a plate-shaped body or member having a size of 4 cm×6cm×0.2 cm.

(3) Formation of Catalyst Activity Inhibiting Layer

The synthetized Polymer A represented by the formula (5) was dissolvedin methylethyl ketone to prepare a polymer solution of which polymerconcentration was 0.5% by weight. The molded base member was dipped inthe prepared polymer solution at the room temperature for 5 seconds, andthen was subjected to drying in a drier at 85° C. for 5 minutes. Withthis, a catalyst activity inhibiting layer was formed on a surface ofthe base member.

The film thickness of the catalyst activity inhibiting layer wasmeasured by a method as explained below. Firstly, a sample for filmthickness measurement, having a resin layer formed thereon under a samecondition as that of this experiment, was prepared. A part of the resinlayer of the sample for film thickness measurement was damaged by aspatula to allow the base member to be exposed in the damaged part; alaser microscope (VK-9710 produced by KEYENCE CORPORATION) was used tomeasure the different in height between the surface of the resin layerand the exposed surface of the base member, and the result of themeasurement was determined to be the film thickness of the catalystactivity inhibiting layer. The film thickness of the catalyst activityinhibiting layer was approximately 70 nm.

(4) Laser Drawing

A laser drawing apparatus (MD-V9929WA produced by KEYENCE CORPORATION;YVO₄ laser; wavelength: 1064 nm) was used to perform laser drawing forthe resin molded product having the catalyst activity inhibiting layerformed thereon, with laser intensity: 80%, drawing velocity: 500 mm/secand frequency: 50 kHz. The drawn pattern was a pattern in which aplurality of pieces of an area of 5 mm×5 cm were aligned at a pitch of0.1 mm.

(5) Application of Electroless Plating Catalyst

A commercially available catalytic solution for electroless plating wasused to apply an electroless plating catalyst, with a generally knownmethod, to a surface of the molded product having the laser drawingperformed thereon. Firstly, the molded product having the laser drawingperformed thereon was immersed in a sensitivity imparting agent at anormal temperature (SENSITIZER produced by OKUNO CHEMICAL INDUSTRIESCO., LTD) and was irradiated with ultrasonic waves for 5 minutes tothereby perform a sensitizing processing; and thus tin colloid was madeto adsorb onto the surface of the molded product. Afterwards, the moldedproduct was taken out from the sensitivity imparting agent, and waswashed by water sufficiently. Next, the molded product was immersed in acatalyzing treatment agent at a normal temperature (ACTIVATOR producedby OKUNO CHEMICAL INDUSTRIES CO., LTD.), was left to stand for 2minutes, and thus was subjected to an activator processing so thatpalladium was made to absorb onto the surface of the molded product.Afterwards, the molded product was taken out from the catalyzingtreatment agent, and was washed by water sufficiently.

(6) Electroless Plating

The molded product having the electroless plating catalyst appliedthereto was immersed in an electroless copper plating solution (OPC-NCAproduced by OKUNO CHEMICAL INDUSTRIES CO., LTD.) for 15 minutes to growan electroless copper plating film on the surface of the molded productsuch that the electroless copper plating film had a thickness of 1 μm.By the production method as explained above, a plated part (platedcomponent) of Experiment 1 was obtained.

<Experiment 2>

In Experiment 2, a plated part was produced by a method similar to thatin Experiment 1, except that a CO₂ laser drawing apparatus was used inthe laser drawing.

(1) Molding of Resin Molded Product (Base Member) and Formation ofCatalyst Activity Inhibiting Layer

A resin molded product (PPS) as the base member was molded and acatalyst activity inhibiting layer containing Polymer A was formed on asurface of the base member, by a method similar to that in Experiment 1.

(2) Laser Drawing

A CO₂ laser drawing apparatus (LP-310 produced by PANASONIC CORPORATION;light source: CO₂; output of laser oscillating section: 12 W on average;light emission peak wavelength: 10.6 μm) was used as the laser drawingapparatus so as to perform laser drawing for the resin molded producthaving the catalyst activity inhibiting layer formed thereon, with laserintensity: 80%, and drawing velocity: 500 mm/sec. The drawn pattern wasa pattern similar to that in Experiment 1.

(3) Application of Electroless Plating Catalyst and Electroless Plating

The application of the electroless plating catalyst and the electrolessplating were performed in this order on the molded product having thelaser drawing performed thereon, by a method similar to that inExperiment 1. With this, an electroless copper plating film was grown onthe surface of the base member such that the electroless copper platingfilm had a thickness of 1 μm. By the production method as explainedabove, a plated part of Experiment 2 was obtained.

<Experiment 3>

In Experiment 3, a plated part was produced by a method similar to thatin Experiment 1, except that an electroless nickel phosphorous platingsolution was used as the plating solution.

(1) Molding of Resin Molded Product (Base Member), Formation of CatalystActivity Inhibiting Layer, Laser Drawing and Application of ElectrolessPlating Catalyst

A resin molded product (PPS) was molded and a catalyst activityinhibiting layer containing Polymer A was formed on a surface of thebase member, by a method similar to that in Experiment 1. The laserdrawing and the application of electroless plating catalyst wereperformed in this order for the molded product having the catalystactivity inhibiting layer formed thereon, by a method similar to that inExperiment 1.

(2) Electroless Plating

The molded product having the electroless plating catalyst appliedthereto was immersed in an electroless nickel phosphorous platingsolution (SE-666 produced by JAPAN KANIGEN CO., LTD.) for 15 minutes soas to grow an electroless nickel phosphorus plating film to on thesurface of the molded product such that the electroless nickelphosphorus plating film had a thickness of 1 By the production method asexplained above, a plated part of Experiment 2 was obtained. Note thatthe electroless nickel phosphorous plating solution used in Experiment 2contains the reducing agent in a content amount greater than that of theelectroless copper plating solution used in Experiment 1. Accordingly,even if the amount of the electroless plating catalyst (Pd) is small,the plating reaction easily progresses.

<Experiment 4>

In Experiment 4, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer B represented by the formula (6)was used as the polymer contained in the catalyst activity inhibitinglayer.

(1) Molding of Resin Molded Product (Base Member)

A resin molded product (PPS) was molded by a method similar to that inExperiment 1.

(2) Formation of Catalyst Activity Inhibiting Layer

In Experiment 4, a catalyst activity inhibiting layer was formed on asurface of the base member by a method similar to that in Experiment 1,except that Polymer B represented by the formula (6) (poly(N-isopropylacrylamide) (PNIPAM) produced by FUNAKOSHI CO., LTD.) was used, ratherthan Polymer A. The polymer B represented by the formula (6) is thepolymer represented by the formula (3); in the formula (3), R⁴ is amethyl group, and R⁵ is an isopropyl group. The molecular weight ofPolymer B was the weight average molecular weight (Mw)=40,000. Thethickness of the formed catalyst activity inhibiting layer was measuredby a method similar to that in Experiment 1. The thickness of thecatalyst activity inhibiting layer was approximately 80 nm.

(3) Laser Drawing, Application of Electroless Plating Catalyst, andElectroless Plating

The laser drawing, the application of electroless plating catalyst andthe electroless plating were performed in this order for the moldedproduct having the catalyst activity inhibiting layer formed thereon, bya method similar to that in Experiment 1. With this, an electrolesscopper plating film was grown on the surface of the base member suchthat the electroless copper plating film had a thickness of 1 μm. By theproduction method as explained above, a plated part of Experiment 4 wasobtained.

<Experiment 5>

In Experiment 5, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer C represented by the formula (7)was used as the polymer contained in the catalyst activity inhibitinglayer.

(1) Molding of Resin Molded Product (Base Member)

A resin molded product (PPS) was molded by a method similar to that inExperiment 1.

(2) Formation of Catalyst Activity Inhibiting Layer

In Experiment 5, a catalyst activity inhibiting layer was formed on asurface of the base member by a method similar to that in Experiment 1,except that Polymer C represented by the formula (7) (PNIPAM, amineterminated, produced by SIGMA-ALDRICH JAPAN CO. LLC.) was used, ratherthan Polymer A. The polymer C represented by the formula (7) is thepolymer represented by the formula (3); in the formula (3), R⁴ is agroup represented by the formula (4), and R⁵ is an isopropyl group. Themolecular weight of Polymer C was the weight average molecular weight(Mw)=5,500. The thickness of the formed catalyst activity inhibitinglayer was measured by a method similar to that in Experiment 1. Thethickness of the catalyst activity inhibiting layer was approximately 80nm.

(3) Laser Drawing, Application of Electroless Plating Catalyst, andElectroless Plating

The laser drawing, the application of electroless plating catalyst andthe electroless plating were performed in this order for the moldedproduct having the catalyst activity inhibiting layer formed thereon, bya method similar to that in Experiment 1. With this, an electrolesscopper plating film was grown on the surface of the base member suchthat the electroless copper plating film had a thickness of 1 μm. By theproduction method as explained above, a plated part of Experiment 5 wasobtained.

<Experiment 6>

In Experiment 6, a plated part was produced by a method similar to thatin Experiment 1, except that the resin molded product (base member) waswashed (cleaned) after the laser drawing.

(1) Molding of Resin Molded Product (Base Member), Formation of CatalystActivity Inhibiting Layer, and Laser Drawing

A resin molded product (PPS) was molded as the base member, a catalystactivity inhibiting layer containing Polymer A was formed on a surfaceof the base member, and the laser drawing was performed for the resinmolded product having the catalyst activity inhibiting layer formedthereon, by a method similar to that in Experiment 1.

(2) Washing of Resin Molded Product (Base Member)

The resin molded product having the laser drawing performed thereon wasimmersed in a commercially available pretreatment agent for plating(CONDICLEAN MA produced by OKUNO CHEMICAL INDUSTRIES CO., LTD) at 60° C.for 15 minutes. Afterwards, the resin molded product was washed oncewith pure water (purified water) at 50° C. and then washed three timeswith pure water (purified water) at the room temperature. The resinmolded product was used for the next step, without being air-dried afterthe washing.

(3) Application of Electroless Plating Catalyst and Electroless Plating

The application of electroless plating catalyst and the electrolessplating were performed in this order for the molded product after thewashing, by a method similar to that in Experiment 1. With this, anelectroless copper plating film was grown on the surface of the basemember such that the electroless copper plating film had a thickness of1 μm. By the production method as explained above, a plated part ofExperiment 6 was obtained.

<Experiment 7>

In Experiment 7, a plated part was produced by a method similar to thatin Experiment 1, except that a CO₂ laser drawing apparatus was used inthe laser drawing and that washing for the resin molded product (basemember) was performed after the laser drawing.

At first, a resin molded product (PPS) as the base member was molded anda catalyst activity inhibiting layer containing Polymer A was formed ona surface of the base member, by a method similar to that inExperiment 1. Next, the laser drawing was performed for the resin moldedproduct having the catalyst activity inhibiting layer formed thereon, bya method similar to that in Experiment 2. Then, the washing wasperformed for the resin molded product, by a method similar to that inExperiment 6. The application of electroless plating catalyst and theelectroless plating were performed in this order for the molded productafter the washing, by a method similar to that in Experiment 1. Withthis, an electroless copper plating film was grown on the surface of thebase member such that the electroless copper plating film had athickness of 1 μm. By the production method as explained above, a platedpart of Experiment 7 was obtained.

<Experiment 8>

In Experiment 8, a plated part was produced by a method similar to thatin Experiment 1, except that the washing was performed for a resinmolded product (base member) after the laser drawing and that anelectroless nickel phosphorous plating solution was used as the platingsolution.

At first, a resin molded product (PPS) was molded, a catalyst activityinhibiting layer containing Polymer A was formed on a surface of thebase member, and the laser drawing was performed therefor, by a methodsimilar to that in Experiment 1. Next, the washing was performed for theresin molded product, in a method similar to that in Experiment 6. Forthe molded product after the washing, the application of electrolessplating catalyst was performed by a method similar to that in Experiment1, and the electroless nickel phosphorous plating was performed by amethod similar to that in Experiment 3. With this, an electroless nickelphosphorous plating film was grown on the surface of the base membersuch that the electroless nickel phosphorus plating film had a thicknessof 1 μm. By the production method as explained above, a plated part ofExperiment 8 was obtained.

<Experiment 9>

In Experiment 9, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer B represented by the formula (6)was used as the polymer contained in the catalyst activity inhibitinglayer, and that the washing was performed for a resin molded product(base member) after the laser drawing.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1, and then a catalyst activity inhibiting layercontaining Polymer B was formed on a surface of the base member by amethod similar to that in Experiment 4. Next, the laser drawing wasperformed for the resin molded product, having the catalyst activityinhibiting layer formed thereon, by a method similar to that inExperiment 1. Then, the washing was performed for the resin moldedproduct, by a method similar to that in Experiment 6. For the moldedproduct after the washing, the application of electroless platingcatalyst and the electroless plating were performed in this order by amethod similar to that in Experiment 1. With this, an electroless copperplating film was grown on the surface of the base member such that theelectroless copper plating film had a thickness of 1 μm. By theproduction method as explained above, a plated part of Experiment 9 wasobtained.

<Experiment 10>

In Experiment 10, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer C represented by the formula (7)was used as the polymer contained in the catalyst activity inhibitinglayer, and that the washing was performed for a resin molded product(base member) after the laser drawing.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1, and then a catalyst activity inhibiting layercontaining Polymer C was formed on a surface of the base member by amethod similar to that in Experiment 5. Next, the laser drawing wasperformed for the resin molded product having the catalyst activityinhibiting layer formed thereon, by a method similar to that inExperiment 1. Then, the washing was performed for the resin moldedproduct, by a method similar to that in Experiment 6. For the moldedproduct after the washing, the application of electroless platingcatalyst and the electroless plating were performed in this order by amethod similar to that in Experiment 1. With this, an electroless copperplating film was grown on the surface of the base member such that theelectroless copper plating film had a thickness of 1 μm. By theproduction method as explained above, a plated part of Experiment 10 wasobtained.

<Experiment 11>

In Experiment 11, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer E represented by the formula (9)was used as the polymer contained in the catalyst activity inhibitinglayer, and that the washing was performed for a resin molded product(base member) after the laser drawing.

(1) Molding of Resin Molded Product (Base Member)

A resin molded product (PPS) was molded by a method similar to that inExperiment 1.

(2) Formation of Catalyst Activity Inhibiting Layer

In Experiment 11, a catalyst activity inhibiting layer was formed on asurface of the base member by a method similar to that in Experiment 1,except that an amino-ethylated acrylic polymer represented by theformula (9) (Polymer E) (POLYMENT NK-350 produced by NIPPON SHOKUBAICO., LTD.) was used, rather than Polymer A. The molecular weight ofPolymer E was the weight average molecular weight (Mw)=100,000. Thethickness of the formed catalyst activity inhibiting layer was measuredby a method similar to that in Experiment 1. The thickness of thecatalyst activity inhibiting layer was 80 nm.

(3) Laser Drawing, Washing of Resin Molded Product (Base Member),Application of Electroless Plating Catalyst, and Electroless Plating

The laser drawing was performed for the molded product having thecatalyst activity inhibiting layer formed thereon, by a method similarto that in Experiment 1, and then the washing of the resin moldedproduct (base member) was performed by a method similar to that inExperiment 6. For the washed base member, the application of electrolessplating catalyst and the electroless plating were performed in thisorder by a method similar to that in Experiment 1. With this, anelectroless copper plating film was grown on the surface of the basemember such that the electroless copper plating film had a thickness of1 μm. By the production method as explained above, a plated part ofExperiment 11 was obtained.

<Experiment 12>

In Experiment 12, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer B represented by the formula (6)was used as the polymer contained in the catalyst activity inhibitinglayer, the CO₂ laser drawing apparatus was used in the laser drawing,and further that the washing was performed for a resin molded product(base member) after the laser drawing.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer B represented by the formula (6) wasused to form a catalyst activity inhibiting layer on a surface of thebase member by a method similar to that in Experiment 4. Then, the laserdrawing was performed for the resin molded product having the catalystactivity inhibiting layer formed thereon, by a method similar to that inExperiment 2 with the use of the CO₂ laser drawing apparatus. Next, thewashing was performed for the resin molded product (base member), by amethod similar to that in Experiment 6. For the washed base member, theapplication of electroless plating catalyst and the electroless platingwere performed in this order by a method similar to that inExperiment 1. With this, an electroless copper plating film was grown onthe surface of the base member such that the electroless copper platingfilm had a thickness of 1 μm. By the production method as explainedabove, a plated part of Experiment 12 was obtained.

<Experiment 13>

In Experiment 13, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer C represented by the formula (7)was used as the polymer contained in the catalyst activity inhibitinglayer, the CO₂ laser drawing apparatus was used in the laser drawing,and further that the washing was performed for a resin molded product(base member) after the laser drawing.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer C represented by the formula (7) wasused to form a catalyst activity inhibiting layer on a surface of thebase member by a method similar to that in Experiment 5. Then, the laserdrawing was performed for the resin molded product having the catalystactivity inhibiting layer formed thereon, by a method similar to that inExperiment 2 with the use of the CO₂ laser drawing apparatus. Next, thewashing was performed for the resin molded product (base member), by amethod similar to that in Experiment 6. For the washed base member, theapplication of electroless plating catalyst and the electroless platingwere performed in this order by a method similar to that inExperiment 1. With this, an electroless copper plating film was grown onthe surface of the base member such that the electroless copper platingfilm had a thickness of 1 μm. By the production method as explainedabove, a plated part of Experiment 13 was obtained.

<Experiment 14>

In Experiment 14, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer E represented by the formula (9)was used as the polymer contained in the catalyst activity inhibitinglayer, the CO₂ laser drawing apparatus was used in the laser drawing,and further that the washing was performed for a resin molded product(base member) after the laser drawing.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer E represented by the formula (9) wasused to form a catalyst activity inhibiting layer on a surface of thebase member by a method similar to that in Experiment 11. Then, thelaser drawing was performed for the resin molded product having thecatalyst activity inhibiting layer formed thereon, by a method similarto that in Experiment 2 with the use of the CO₂ laser drawing apparatus.Next, the washing was performed for the resin molded product (basemember), by a method similar to that in Experiment 6. For the washedbase member, the application of electroless plating catalyst and theelectroless plating were performed in this order by a method similar tothat in Experiment 1. With this, an electroless copper plating film wasgrown on the surface of the base member such that the electroless copperplating film had a thickness of 1 μm. By the production method asexplained above, a plated part of Experiment 14 was obtained.

<Experiment 15>

In Experiment 15, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer B represented by the formula (6)was used as the polymer contained in the catalyst activity inhibitinglayer, the washing was performed for a resin molded product (basemember) after the laser drawing, and further that an electroless nickelphosphorous plating solution was used as the plating solution.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer B represented by the formula (6) wasused to form a catalyst activity inhibiting layer on a surface of thebase member, by a method similar to that in Experiment 4. Then, thelaser drawing was performed for the resin molded product having thecatalyst activity inhibiting layer formed thereon, by a method similarto that in Experiment 1. Next, the washing was performed for the resinmolded product (base member), by a method similar to that in Experiment6. For the base member after the washing, the application of electrolessplating catalyst was performed by a method similar to that in Experiment1, and then the electroless nickel phosphorous plating solution was usedto thereby grow an electroless nickel phosphorous plating film on thesurface of the molded product such that the electroless nickelphosphorous plating film had a thickness of 1 μm, by the method similarto that in Experiment 3. By the production method as explained above, aplated part of Experiment 15 was obtained.

<Experiment 16>

In Experiment 16, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer C represented by the formula (7)was used as the polymer contained in the catalyst activity inhibitinglayer, the washing was performed for a resin molded product (basemember) after the laser drawing, and further that an electroless nickelphosphorous plating solution was used as the plating solution.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer C represented by the formula (7) wasused to form a catalyst activity inhibiting layer on a surface of thebase member by a method similar to that in Experiment 5. Then, the laserdrawing was performed for the resin molded product having the catalystactivity inhibiting layer formed thereon, by a method similar to that inExperiment 1. Next, the washing was performed for the resin moldedproduct (base member), by a method similar to that in Experiment 6. Forthe molded product after the washing, the application of electrolessplating catalyst was performed by a method similar to that in Experiment1, and then the electroless nickel phosphorous plating solution was usedto thereby grow an electroless nickel phosphorous plating film on thesurface of the molded product such that the electroless nickelphosphorous plating film had a thickness of 1 μm, by the method similarto that in Experiment 3. By the production method as explained above, aplated part of Experiment 16 was obtained.

<Experiment 17>

In Experiment 17, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer E represented by the formula (9)was used as the polymer contained in the catalyst activity inhibitinglayer, the washing was performed for a resin molded product (basemember) after the laser drawing, and further that an electroless nickelphosphorous plating solution was used as the plating solution.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer E represented by the formula (9) wasused to form a catalyst activity inhibiting layer on a surface of thebase member by a method similar to that in Experiment 11. Then, thelaser drawing was performed for the resin molded product having thecatalyst activity inhibiting layer formed thereon, by a method similarto that in Experiment 1. Next, the washing was performed for the resinmolded product (base member), by a method similar to that in Experiment6. For the molded product after the washing, the application ofelectroless plating catalyst was performed by a method similar to thatin Experiment 1, and then the electroless nickel phosphorous platingsolution was used to thereby grow an electroless nickel phosphorousplating film on the surface of the molded product such that theelectroless nickel phosphorous plating film had a thickness of by amethod similar to that in Experiment 3. By the production method asexplained above, a plated part of Experiment 17 was obtained.

<Experiment 18>

In Experiment 18, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer F represented by the formula (10)was used as the polymer contained in the catalyst activity inhibitinglayer, and the washing was performed for a resin molded product (basemember) after the laser drawing.

(1) Molding of Resin Molded Product (Base Member)

A resin molded product (PPS) was molded by a method similar to that inExperiment 1.

(2) Formation of Catalyst Activity Inhibiting Layer

In Experiment 18, a catalyst activity inhibiting layer was formed on asurface of the base member by a method similar to that in Experiment 1,except that polyamide-imide represented by the formula (10) (Polymer F)(produced by TORAY INDUSTRIES, INC.) was used, rather than Polymer A.The thickness of the formed catalyst activity inhibiting layer wasmeasured by a method similar to that in Experiment 1. The thickness ofthe catalyst activity inhibiting layer was approximately 100 nm.

(3) Laser Drawing, Washing of Resin Molded Product (Base Member),Application of Electroless Plating Catalyst, and Electroless Plating

The laser drawing was performed for the molded product having thecatalyst activity inhibiting layer formed thereon, by a method similarto that in Experiment 1, and then the washing of the resin moldedproduct (base member) was performed by a method similar to that inExperiment 6. For the washed base member, the application of electrolessplating catalyst and the electroless plating were performed in thisorder by a method similar to that in Experiment 1. With this, anelectroless copper plating film was grown on the surface of the basemember such that the electroless copper plating film had a thickness of1 μm. By the production method as explained above, a plated part ofExperiment 18 was obtained.

<Experiment 19>

In Experiment 19, a plated part was produced by a method similar to thatin Experiment 1, except that Polymer F represented by the formula (10)was used as the polymer contained in the catalyst activity inhibitinglayer, the washing was performed for a resin molded product (basemember) after the laser drawing, and further that an electroless nickelphosphorous plating solution was used as the plating solution.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer F represented by the formula (10)was used to form a catalyst activity inhibiting layer on a surface ofthe base member by a method similar to that in Experiment 18. Then, thelaser drawing was performed for the resin molded product having thecatalyst activity inhibiting layer formed thereon, by a method similarto that in Experiment 1. Next, the washing was performed for the resinmolded product (base member), by a method similar to that in Experiment6. For the base member after the washing, the application of electrolessplating catalyst was performed by a method similar to that in Experiment1, and then the electroless nickel phosphorous plating solution was usedto grow an electroless nickel phosphorous plating film on the surface ofthe molded product such that the electroless nickel phosphorous platingfilm had a thickness of 1 μm, by the method similar to that inExperiment 3. By the production method as explained above, a plated partof Experiment 19 was obtained.

<Experiment 20>

In Experiment 20, a plated part was produced by a method similar to thatin Experiment 1, except that polyamide molded into a plated shape as abase member was used, and the washing was performed for a resin moldedproduct (base member) after the laser drawing.

(1) Molding of Resin Molded Product (Base Member)

In Experiment 20, a resin molded product was molded by a method similarto that in Experiment 1, except that polyamide (PA) (VYLOAMIDE producedby TOYOBO CO., LTD.), rather than using PPS.

(2) Formation of Catalyst Activity Inhibiting Layer, Laser Drawing,Washing of Resin Molded Product (Base Member), Application ofElectroless Plating Catalyst, and Electroless Plating

A catalyst activity inhibiting layer containing Polymer A was formed ona surface of the base member by a method similar to that inExperiment 1. The laser drawing was performed for the molded producthaving the catalyst activity inhibiting layer formed thereon, by amethod similar to that in Experiment 1, and then the washing of theresin molded product (base member) was performed by a method similar tothat in Experiment 6. For the washed base member, the application ofelectroless plating catalyst and the electroless plating were performedin this order by a method similar to that in Experiment 1. With this, anelectroless copper plating film was grown on the surface of the basemember such that the electroless copper plating film had a thickness of1 μm. By the production method as explained above, a plated part ofExperiment 20 was obtained.

<Experiment 21>

In Experiment 21, a plated part was produced by a method similar to thatin Experiment 1, except that polyamide molded into a plated shape as abase member was used, and the washing was performed for a resin moldedproduct (base member) after the laser drawing, and further that anelectroless nickel phosphorous plating solution was used as the platingsolution.

At first, a resin molded product (PA) was molded by a method similar tothat in Experiment 20. Next, a catalyst activity inhibiting layercontaining Polymer A was formed on a surface of the base member by amethod similar to that in Experiment 1. The laser drawing was performedfor the molded product having the catalyst activity inhibiting layerformed thereon, by a method similar to that in Experiment 1. Then, thewashing of the resin molded product (base member) was performed by amethod similar to that in Experiment 6. For the molded product after thewashing, the application of electroless plating catalyst was performedby a method similar to that in Experiment 1; and then the electrolessnickel phosphorous plating solution was used to thereby grow anelectroless nickel phosphorous plating film on the surface of the moldedproduct such that the electroless nickel phosphorous plating film had athickness of 1 μm, by a method similar to that in Experiment 3. By theproduction method as explained above, a plated part of Experiment 21 wasobtained.

<Experiment 22>

In Experiment 22, a plated part was produced by a method similar to thatin Experiment 1, except that polyamide molded into a plated shape as abase member was used, and the washing was performed for a resin moldedproduct (base member) after the laser drawing.

(1) Molding of Resin Molded Product (Base Member)

In Experiment 22, a resin molded product was molded by a method similarto that in Experiment 1, except that polyamide (PA) (AMODEL AS-1566HSproduced by SOLVAY JAPAN, LTD.), rather than using PPS.

(2) Formation of Catalyst Activity Inhibiting Layer, Laser Drawing,Washing of Resin Molded Product (Base Member), Application ofElectroless Plating Catalyst, and Electroless Plating

A catalyst activity inhibiting layer containing Polymer A was formed ona surface of the base member by a method similar to that inExperiment 1. The laser drawing was performed for the molded producthaving the catalyst activity inhibiting layer formed thereon, by amethod similar to that in Experiment 1, and then the washing of theresin molded product (base member) was performed by a method similar tothat in Experiment 6. For the washed base member, the application ofelectroless plating catalyst and the electroless plating were performedin this order by a method similar to that in Experiment 1. With this, anelectroless copper plating film was grown on the surface of the basemember such that the electroless copper plating film had a thickness of1 μm. By the production method as explained above, a plated part ofExperiment 22 was obtained.

<Experiment 23>

In Experiment 23, a plated part was produced by a method similar to thatin Experiment 1, except that polyamide molded into a plated shape as abase member was used, and the washing was performed for a resin moldedproduct (base member) after the laser drawing, and further that anelectroless nickel phosphorous plating solution was used as the platingsolution.

At first, a resin molded product (PA) was molded by a method similar tothat in Experiment 22. Next, a catalyst activity inhibiting layercontaining Polymer A was formed on a surface of the base member by amethod similar to that in Experiment 1. The laser drawing was performedfor the resin molded product having the catalyst activity inhibitinglayer formed thereon, by a method similar to that in Experiment 1. Next,the washing was performed for the resin molded product (base member), bya method similar to that in Experiment 6. For the molded product afterthe washing, the application of electroless plating catalyst wasperformed by a method similar to that in Experiment 1, and then theelectroless nickel phosphorous plating solution was used to thereby growan electroless nickel phosphorous plating film on the surface of themolded product such that the electroless nickel phosphorous plating filmhad a thickness of 1 μm, by the production method similar to that inExperiment 3. By the method as explained above, a plated part ofExperiment 23 was obtained.

<Experiment 24>

In Experiment 24, a plated part was produced by a method similar to thatin Experiment 1, except that a resin layer containing Polymer Drepresented by the formula (8), rather than the catalyst activityinhibiting layer, was formed on a base member, and that the washing wasperformed for a resin molded product (base member) after the laserdrawing.

(1) Molding of Resin Molded Product (Base Member)

A resin molded product (PPS) was molded by a method similar to that inExperiment 1.

(2) Formation of Resin Layer

In Experiment 24, a resin layer was formed on a surface of the basemember by a method similar to that in Experiment 1, except that ahyper-branched polymer (HYPERTECH HPS-200 produced by NISSAN CHEMICALCORPORATION) was used, rather than Polymer A. The molecular weight ofPolymer D was the weight average molecular weight (Mw)=23,000. Thethickness of the formed resin layer was measured by a method similar tothat in Experiment 1. The thickness of the resin layer was 80 nm.

(3) Laser Drawing, Washing of Resin Molded Product (Base Member),Application of Electroless Plating Catalyst, and Electroless Plating

The laser drawing was performed for the molded product having the resinlayer formed thereon, by a method similar to that in Experiment 1, andthen the washing of the resin molded product (base member) was performedby a method similar to that in Experiment 6. For the washed base member,the application of electroless plating catalyst and the electrolessplating were performed in this order by a method similar to that inExperiment 1. With this, an electroless copper plating film was grown onthe surface of the base member such that the electroless copper platingfilm had a thickness of 1 μm. By the production method as explainedabove, a plated part of Experiment 24 was obtained.

<Experiment 25>

In Experiment 25, a plated part was produced by a method similar to thatin Experiment 1, except that a resin layer containing Polymer Drepresented by the formula (8), rather than the catalyst activityinhibiting layer, was formed on a base member, that a CO₂ laser drawingapparatus was used in the laser drawing, and further that washing forthe resin molded product (base member) was performed after the laserdrawing.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer D represented by the formula (8) wasused to form a resin layer on a surface of the base member, by a methodsimilar to that in Experiment 24. The laser drawing was performed forthe resin molded product having the resin layer formed thereon, by amethod similar to that in Experiment 2 with the use of the CO₂ laserdrawing apparatus. Then, the washing was performed for the resin moldedproduct (base member), by a method similar to that in Experiment 6. Theapplication of electroless plating catalyst and the electroless platingwere performed in this order for the base member after the washing, by amethod similar to that in Experiment 1. With this, an electroless copperplating film was grown on the surface of the base member such that theelectroless copper plating film had a thickness of 1 μm. By theproduction method as explained above, a plated part of Experiment 25 wasobtained.

<Experiment 26>

In Experiment 26, a plated part was produced by a method similar to thatin Experiment 1, except that a resin layer containing Polymer Drepresented by the formula (8), rather than the catalyst activityinhibiting layer, was formed on a base member, that washing for theresin molded product (base member) was performed after the laserdrawing, and further that an electroless nickel phosphorous platingsolution was used as the plating solution.

At first, a resin molded product (PPS) was molded by a method similar tothat in Experiment 1. Next, Polymer D represented by the formula (8) wasused to form a resin layer on a surface of the base member, by a methodsimilar to that in Experiment 24. The laser drawing was performed forthe resin molded product having the resin layer formed thereon, by amethod similar to that in Experiment 1. Next, the washing was performedfor the resin molded product (base member), by a method similar to thatin Experiment 6. The application of electroless plating catalyst wasperformed for the molded product after the washing, by a method similarto that in Experiment 1, and then the electroless nickel phosphorousplating solution was used to thereby grow an electroless nickelphosphorous plating film on the surface of the molded product such thatthe electroless nickel phosphorous plating film had a thickness of 1 μm,by the method similar to that in Experiment 3. By the production methodas explained above, a plated part of Experiment 26 was obtained.

<Evaluation>

The plated parts produced in Experiments 1 to 26, respectively, asexplained above were visually observed, and the plating precipitationproperty and the plating selectivity were evaluated. The results of theevaluation are indicated in TABLE 1.

<Criterion for Evaluation of Plating Precipitation Property>

+: The plating film is grown in a laser drawing portion.

−: The plating film is not grown in a laser drawing portion.

<Criterion for Evaluation of Plating Selectivity>

+: The plating film is grown only in a laser drawing portion.

±: The plating film is grown partially also in a portion different fromthe laser drawing portion.

−: The plating film is grown in the entirety of the base material.

TABLE 1 Results of Evaluation Material and Production Method PlatingBase Washing of precipitation Plating Experiment member Polymer Laserbase member Electroless plating property selectivity 1 PPS Polymer AYVO₄ none Electroless Cu plating + ± 2 PPS Polymer A CO₂ noneElectroless Cu plating + ± 3 PPS Polymer A YVO₄ none Electroless NiPplating + ± 4 PPS Polymer B YVO₄ none Electroless Cu plating + ± 5 PPSPolymer C YVO₄ none Electroless Cu plating + ± 6 PPS Polymer A YVO₄ yesElectroless Cu plating + + 7 PPS Polymer A CO₂ yes Electroless Cuplating + + 8 PPS Polymer A YVO₄ yes Electroless NiP plating + + 9 PPSPolymer B YVO₄ yes Electroless Cu plating + + 10 PPS Polymer C YVO₄ yesElectroless Cu plating + + 11 PPS Polymer E YVO₄ yes Electroless Cuplating + ± 12 PPS Polymer B CO₂ yes Electroless Cu plating + + 13 PPSPolymer C CO₂ yes Electroless Cu plating + + 14 PPS Polymer E CO₂ yesElectroless Cu plating + ± 15 PPS Polymer B YVO₄ yes Electroless NiPplating + − 16 PPS Polymer C YVO₄ yes Electroless NiP plating + − 17 PPSPolymer E YVO₄ yes Electroless NiP plating + − 18 PPS Polymer F YVO₄ yesElectroless Cu plating + ± 19 PPS Polymer F YVO₄ yes Electroless NiPplating + − 20 PA Polymer A YVO₄ yes Electroless Cu plating + + 21 PAPolymer A YVO₄ yes Electroless NiP plating + + 22 PA Polymer A YVO₄ yesElectroless Cu plating + + 23 PA Polymer A YVO₄ yes Electroless NiPplating + + 24 PPS Polymer D YVO₄ yes Electroless Cu plating + − 25 PPSPolymer D CO₂ yes Electroless Cu plating + − 26 PPS Polymer D YVO₄ yesElectroless NiP plating + −

(1) Regarding Experiments 6 to 19 and 24 to 26

In all of Experiments 6 to 19 and 24 to 26, the polyphenylene sulfide(PPS) was used for forming the base member, and the washing of thesubstrate (base member) was performed after the irradiation with thelaser beam. With respect to the six kinds of polymers which are: PolymerA used in Experiments 6 to 8, Polymer B used in Experiments 9, 12 and15, Polymer C used in Experiments 10, 13 and 16, Polymer D used inExperiments 24 to 26, Polymer E used in Experiments 11, 14 and 17, andPolymer F used in Experiments 18 and 19 were subjected to the overallevaluation based on the results of evaluation of the plating selectivityindicated in TABLE 1, in accordance with the following criterion for theoverall evaluation. The results of the overall evaluation are indicatedin TABLE 2.

<Criterion for Overall Evaluation>

++: The plating selectivity of electroless copper plating and theplating selectivity of electroless nickel phosphorous plating were both“+”.

+: Although the plating selectivity of electroless copper plating was“+”, the plating selectivity of electroless nickel phosphorous platingwas “−”.

±: Although the plating selectivity of electroless copper plating was“±”, the plating selectivity of electroless nickel phosphorous platingwas “−”.

−: The plating selectivity of electroless copper plating and the platingselectivity of electroless nickel phosphorous plating were both “−”.

TABLE 2 Results of Evaluation Plating Selectivity Overall ExperimentElectroless Electroless Evalua- No. Polymer Cu plating NiP plating tionExamples Experiments Polymer + + ++ 6 to 8 A Experiments Polymer + − +9, 12, 15 B Experiments Polymer + − + 10, 13, 16 C Experiments Polymer ±− ± 11, 14, 17 E Experiments Polymer ± − ± 18, 19 F Com- ExperimentsPolymer − − − parative 24 to 26 D Example

As indicated in TABLE 1 and TABLE 2, the plated parts each produced byusing one of Polymers A to C, E and F having at least one of amide groupand amino group were satisfactory in both of the plating precipitationproperty and the plating selectivity of the electroless copper plating(overall evaluation: ++, +, ±). It is presumed that, in the laserdrawing portion, the electroless copper plating film was grown since thecatalyst activity inhibiting layer was removed; whereas in a portiondifferent from the laser drawing portion, the growth of the electrolesscopper plating was inhibited (suppressed) due to the presence of thecatalyst activity inhibiting layer. From the results, it was appreciatedthat Polymers A to C, E and F function as the catalyst activityinhibiting agent. It is presumed that the amide group and/or amino groupcontained in Polymers A to C, E and F inhibited the catalytic activityof the electroless plating catalyst.

Among these plated parts, the plated parts produced by using Polymers Ato C each of which is the branched polymer having the amide group in theside chain were particularly satisfactory in the plating selectivity ofthe electroless copper plating (the result of overall evaluation: ++ or+) as compared with the plated parts produced by using Polymers E and F.Polymer E is a branched polymer having the amino group, and Polymer F isa polymer having the amide group in the straight chain. From thisresult, it is assumed that Polymers A to C each of which is the branchedpolymer having the amide group in the side chain is highly effective ininhibiting the catalytic activity of the electroless plating catalyst.

Further, the plated parts produced by using Polymer A which is thehyper-branched polymer also had an excellent plating selectivity of theelectroless nickel phosphorous plating, in addition to that of theelectroless copper plating (result of the overall evaluation: ++). Theelectroless nickel phosphorous plating solution contains the reducingagent in the content amount greater than that of the electroless copperplating solution. Accordingly, the electroless plating reaction easilyprogresses in the electroless nickel phosphorous plating, as comparedwith the electroless copper plating. Also in such an electroless nickelphosphorous plating, Polymer A functioned sufficiently as the catalystactivity inhibiting agent which inhibits the catalytic activity of theelectroless plating catalyst. The reason for this is presumed asfollows. Namely, since Polymer A has many side chains which are highlyflexible, Polymer A is easily adsorbed to palladium (Pd) as theelectroless plating catalyst and functions as the polydentate ligand,thereby forming a firm chelate structure with the electroless platingcatalyst (palladium ion). With this, also in the electroless nickelphosphorous plating solution containing the large amount of the reducingagent, the reduction of the palladium ion is suppressed (inhibited),which results in the suppression (inhibition) of the formation ofelectroless plating film.

On the other hand, in the plating parts produced by using Polymer D, theplating film was grown in the entirety of the base member both in thecases of the electroless copper plating and the electroless nickelphosphorus plating, and was not capable of selectively forming theplating film (plating precipitation property: +, plating selectivity: −,overall evaluation: −). From this result, it is appreciated that PolymerD does not function as the catalytic activity inhibiting agent. PolymerD is the hyper-branched polymer having a group containing sulfur(dithiocarbamate group). The dithiocarbamate group is considered ashaving a tendency to adsorb the electroless plating catalyst thereto.However, it is presumed that since Polymer D which does not have theamide group and/or the amino group cannot trap the electroless platingcatalyst firmly, Polymer D did not function as the catalytic activityinhibiting agent.

(2) Regarding Experiments 1 to 5

Experiments 1 to 5 were conducted under conditions similar to those ofExperiments 6 to 10, respectively, except that the washing of thesubstrate (base member) was not performed after the irradiation withlaser beam. The results of evaluation of plating selectivity inExperiments 1 to 5 are inferior, to some extent, to the results ofevaluation of plating selectivity in Experiments 6 to 10. From thisresult, it is presumed that the plating selectivity is improved by thewashing of the substrate (base member) which is performed after theirradiation with laser beam.

(3) Regarding Experiments 20 to 23

Experiments 20 to 22 were conducted under conditions similar to those ofExperiment 6, except that the resin molded product of polyamide wasused; Experiments 21 and 23 were conducted under conditions similar tothose of Experiment 8, except that the resin molded product of polyamidewas used. The result of evaluation of the plating selectivity inExperiments 20 to 23 were excellent similarly to the result ofevaluation of the plating selectivity in Experiments 6 and 8. From thisresult, it was confirmed that the selective plating can be realized alsoby using the resin molded product of polyamide.

According to the method of producing plating part of the presentteaching, it is possible to form a plating film only in a predefinedpattern, while suppressing any formation of the plating film in a partor portion (location) different from the predefined pattern, by a simpleproducing process with respect to base members of a variety of kinds ofmaterials. Accordingly, the present teaching is applicable to productionof an electric part having an electric circuit, a three-dimensionalcircuit (Molded Interconnect Device: MID), etc.

What is claimed is:
 1. A method for producing a plated part, comprising:forming, on a surface of a base member, a catalyst activity inhibitinglayer containing a dendritic polymer which has an aromatic ring and atleast one of an amide group and an amino group, wherein the dendriticpolymer has a group containing sulfur; irradiating with light or heatinga part of the surface of the base member on which the catalyst activityinhibiting layer is formed; applying an electroless plating catalyst tothe surface of the base member heated or irradiated with the light; andbringing an electroless plating solution into contact with the surfaceof the base member to which the electroless plating catalyst is applied,to form an electroless plating film at a light-irradiated portion or aheated portion of the surface.
 2. The method for producing the platedpart according to claim 1, further comprising washing the surface of thebase member after the part of the surface of the base member is heatedor irradiated with the light and before the electroless plating solutionis brought into contact with the surface of the base member.
 3. Themethod for producing the plated part according to claim 1, wherein aninhibiting layer-removed portion from which the catalyst activityinhibiting layer is removed and an inhibiting layer-remaining portion inwhich the catalyst activity inhibiting layer remains are formed on thebase member by the irradiating with the light or the heating the part ofthe surface of the base member, and the electroless plating film isformed at the inhibiting layer-removed portion.
 4. The method forproducing the plated part according to claim 1, wherein the dendriticpolymer is a hyper-branched polymer.
 5. The method for producing theplated part according to claim 1, wherein the dendritic polymer has anumber average molecular weight of 3,000 to 30,000 and has a weightaverage molecular weight of 10,000 to 300,000.
 6. The method forproducing the plated part according to claim 1, wherein the groupcontaining sulfur is a sulfide group or a dithiocarbamate group.
 7. Amethod for producing a plated part, comprising: forming, on a surface ofa base member, a catalyst activity inhibiting layer containing adendritic polymer which has an aromatic ring and at least one of anamide group and an amino group wherein the dendritic polymer isrepresented by the following formula (1),

in the formula (1), A¹ is a group containing an aromatic ring, A² is agroup containing sulfur or an amino group, R¹ is a single bond or asubstituted or unsubstituted alkylene group having 1 to 5 carbon atoms,each of R² and R³ is hydrogen or a substituted or unsubstituted alkylgroup having 1 to 10 carbon atoms, and m1 is in a range of 1 to 10, andn1 is in a range of 5 to 100; irradiating with light or heating a partof the surface of the base member on which the catalyst activityinhibiting layer is formed; applying an electroless plating catalyst tothe surface of the base member heated or irradiated with the light; andbringing an electroless plating solution into contact with the surfaceof the base member to which the electroless plating catalyst is applied,to form an electroless plating film at a light-irradiated portion or aheated portion of the surface.
 8. The method for producing the platedpart according to claim 7, wherein the dendritic polymer is representedby the formula (1), and wherein in the formula (1), A¹ is a grouprepresented by the following formula (2):

A² is a dithiocarbamate group, R¹ is a single bond, R² is hydrogen, andR³ is an isopropyl group.
 9. The method for producing the plated partaccording to claim 7, further comprising washing the surface of the basemember after the part of the surface of the base member is heated orirradiated with the light and before the electroless plating solution isbrought into contact with the surface of the base member.
 10. The methodfor producing the plated part according to claim 7, wherein aninhibiting layer-removed portion from which the catalyst activityinhibiting layer is removed and an inhibiting layer-remaining portion inwhich the catalyst activity inhibiting layer remains are formed on thebase member by the irradiating with the light or the heating the part ofthe surface of the base member, and the electroless plating film isformed at the inhibiting layer-removed portion.
 11. The method forproducing the plated part according to claim 7, wherein the dendriticpolymer is a hyper-branched polymer.
 12. The method for producing theplated part according to claim 7, wherein the dendritic polymer has anumber average molecular weight of 3,000 to 30,000 and has a weightaverage molecular weight of 10,000 to 300,000.